Copper Plating CONTAC S4 4-layer Board Process

Created October 18, 2024

Responsible department: Mercer XLab

Preview of CONTAC S4 Copper Plating

https://www.youtube.com/watch?v=38jgkDrL4yI

Purpose

↓ This procedure lists the step-by-step process of Galvanic Through Hole plating a 4-layer PCB with copper using the LPKF CONTAC S4.

Context and Supplemental Information

↓ Add any related and useful information about the process

HowTo.en-US.pdf

Safety Data Sheets and Relevant Docs

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See Contac S4-Guide and Tips for PERFECT PLATING written by Jimmy Nolan at University of Maryland

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See MultiPress SOP

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See PCB Printing S104 Procedure

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Safety Data Sheet LPKF Cleaner 110

LPKF Cleaner 110.pdf

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Safety Data Sheet LPKF Cleaner 210

LPKF Cleaner 210.pdf

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Safety Data Sheet LPKF Activator 310

LPKF Activator 310.pdf

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Safety Data Sheet LPKF Copper Plater 400

LPKF Copper Plater.pdf

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Terminologies